You can remove RAM with an 858D, but you’re risking the board.

It can work, but I wouldn’t rely on it for clean removal.

The 858D is a decent entry-level hot air station, but it’s not designed for BGA work. RAM chips (especially on motherboards or laptops) sit on large ground planes that suck away heat. The 858D’s airflow is uneven and the nozzle is small, so you end up cooking the surrounding area while the chip’s solder barely liquifies. Without bottom preheating, you’re fighting thermal mass, which makes it easy to lift pads or delaminate the board.

Hobbyists do pull it off — with good flux, pre-baking the board, and very steady hands. But for anything valuable or complex (like a laptop or console repair), a proper BGA rework station with bottom heat and controlled temperature profiles is miles better. The 858D is fine for small SMD components, not for RAM-sized BGA packages.

Your motherboard will thank you for the extra investment.