Yes, use low-melt solder for RAM chips.

RAM chips are BGA components, just smaller. Low-melt solder reduces pad lift risk exactly the same way: by lowering the reflow temperature and making the joint stay liquid longer, so you don’t have to crank the heat or pry the chip off while the solder is solid.

The bigger danger with RAM chips is that the PCB is thinner and the pads are tiny. Overheating lifts them fast. Low-melt gives you a wider window to work safely.

If you’re using a hot plate or bottom preheater plus hot air, low-melt is almost mandatory. If you’re using a soldering iron and tape method, less so — but still worth it for peace of mind. Cheap insurance.