Soldered RAM removal is high-risk. You will likely damage something nearby.

Very high. Almost guaranteed on modern boards.

The CPU and VRMs are right next to the RAM slots, and removing soldered RAM requires intense, sustained heat — 350-400°F — focused on a tiny area. That heat travels. The CPU’s BGA balls underneath can reflow and short. VRM capacitors and mosfets can desolder themselves or get fried. Even a small slip with the hot air nozzle can blow components off the board.

Professional board repair techs do this with controlled preheat, specialized nozzles, and practice. First-timers almost always lift pads, cook nearby chips, or create invisible damage that kills the board weeks later.

If you’re asking this question, you probably shouldn’t try it.