Hot air station is non-negotiable for soldered RAM upgrades.

Yes, you need a hot air station — a soldering iron alone won’t cut it. Soldered RAM (like on many thin laptops) uses BGA (ball grid array) chips with tiny solder balls underneath. You can’t reach them with an iron.

The essentials: a hot air station with fine nozzle control, good flux (don’t skimp), a stencil matching your chip, a solder ball kit or paste, and Kapton tape for protecting surrounding components. A preheater helps but isn’t mandatory if you’re careful. Tweezers with curved tips are nice to have.

Most people underestimate the reballing step — aligning that stencil and getting balls to stay put is fiddly. A proper work holder or vise makes a difference.

This is not a beginner project. If you haven’t done BGA work before, expect to trash a board or two learning. Pay a repair shop unless you’re okay with that risk.