Don't use solder wire for BGA RAM.

Don’t use solder wire for BGA RAM.

You shouldn’t be using solder wire to attach a BGA chip. BGA (ball grid array) chips don’t get soldered with wire — they use pre-formed solder balls or solder paste. The chip sits on top of those tiny balls, and you reflow the whole thing with hot air or an infrared station. Hand-dabbing wire onto those pads is a recipe for shorts and lifted pads.

If you’re reballing a BGA chip, you’ll use a stencil and solder balls (typically 0.3mm–0.5mm diameter depending on the chip pitch), not wire. If you’re soldering a new pre-balled chip, you apply flux and heat — no wire needed. The only time solder wire comes into play is for through-hole or discrete SMD components on the same board.

Trying to use wire for BGA is like using a hammer on a screw. Get the right tool: paste, balls, or a pre-balled chip. Future you will thank past you.